This process uses the ProtoLaser only to etch a single side of substrate and cut the board out. It is strongly advised not to attempt any holes using this process, including fiducials! The ProtoLaser is, frankly, not good at making holes, and you’ll be sad when your parts don’t fit.

The other thing to be aware of is that you’ll need to push quite hard to remove the board out of the substrate. For thinner substrates, this might be damaging, so carefully consider what you need before starting this. The tabs are 0.5mm thick by default (so a very thin knife), but this can actually be changed - see our "Adjusting breakout tabs" page for details.

Single-sided, no drills process

  • process_1s-noholes.txt
  • Last modified: 2023/02/11 23:24
  • by benh