This is an old revision of the document!

So you made a few boards. Or not! Either way, this is a running list of tips and tricks for users - things to do and things to avoid. We make no guarantee with any of these, but we have found that they've helped us in some way.

  • Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through and soldered on both the top and bottom.
  • Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time because more of the substrate will be etched. “Isolataion” is usually a setting that you can edit per specific polygon; 10 mil is the default often, but 24 or 32 mil (or more, though the benefits decrease) will reduce the risks further.
  • We haven't done a lot of slots, so YMMV. If you figure out a good method, let us know.
  • If you're interested in optimizing your ProtoLaser experience, see the LPKF ProtoLaser Optimization document for more information.

The Book of Kane

  • pcb-tips.1611079329.txt.gz
  • Last modified: 2021/01/19 13:02
  • by benh