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start [2023/10/17 15:24] – stevs_77 | start [2024/02/09 11:04] – [PCB Fabrication] benh | ||
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==== PCB Fabrication ==== | ==== PCB Fabrication ==== | ||
- | ** Fall 2023 updates: ** | + | ** The electroplater is no longer |
- | * **//We are no longer | + | |
- | * ** Training is still required for the electroplater!** Training details | + | |
- | * If you haven' | + | |
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* [[pcb-help_pm|The LPKF ProtoMat S103]] - a 2.5-dimensional plotter that drills and mills (cuts) PCB substrates, plastics, and soft metals | * [[pcb-help_pm|The LPKF ProtoMat S103]] - a 2.5-dimensional plotter that drills and mills (cuts) PCB substrates, plastics, and soft metals | ||
* [[pcb-help_pl|The LPKF ProtoLaser U4]] - a 20um-diameter laser to etch (selectively remove) a wide variety of film/ | * [[pcb-help_pl|The LPKF ProtoLaser U4]] - a 20um-diameter laser to etch (selectively remove) a wide variety of film/ | ||
- | * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic galvanic electroplater for via formation and other copper/tin plating needs. ** The electroplater is up and functioning.** | + | * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic galvanic electroplater for via formation and other copper/tin plating needs. ** The electroplater |
We also can [[process_stencils|cut stencils]], and assemble boards with a [[process_reflowoven|reflow oven]]. We also have a few unsupported capabilities, | We also can [[process_stencils|cut stencils]], and assemble boards with a [[process_reflowoven|reflow oven]]. We also have a few unsupported capabilities, | ||
The Hive provides double-sided copper on FR4 in 0.5 oz/ft^2 (18 um) and 1 oz/ft^2 (35 um) weights to our users at no cost, though many other substrates can be used. | The Hive provides double-sided copper on FR4 in 0.5 oz/ft^2 (18 um) and 1 oz/ft^2 (35 um) weights to our users at no cost, though many other substrates can be used. | ||
+ | |||
+ | **//We are no longer requiring training for the ProtoMat or ProtoLaser.// | ||
Our DRC file: [[https:// | Our DRC file: [[https:// |