Differences
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| start [2023/02/13 12:26] – [PCB Fabrication] benh | start [2023/05/12 15:50] – [PCB Fabrication] benh | ||
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| * [[pcb-help_pm|The LPKF ProtoMat S103]] - a 2.5-dimensional plotter that drills and mills (cuts) PCB substrates, plastics, and soft metals | * [[pcb-help_pm|The LPKF ProtoMat S103]] - a 2.5-dimensional plotter that drills and mills (cuts) PCB substrates, plastics, and soft metals | ||
| * [[pcb-help_pl|The LPKF ProtoLaser U4]] - a 20um-diameter laser to etch (selectively remove) a wide variety of film/ | * [[pcb-help_pl|The LPKF ProtoLaser U4]] - a 20um-diameter laser to etch (selectively remove) a wide variety of film/ | ||
| - | * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic galvanic electroplater for via formation and other copper/tin plating needs | + | * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic galvanic electroplater for via formation and other copper/tin plating needs. ** The electroplater is up and functioning.** |
| We also can [[process_stencils|cut stencils]], and assemble boards with a [[process_reflowoven|reflow oven]]. We also have a few unsupported capabilities, | We also can [[process_stencils|cut stencils]], and assemble boards with a [[process_reflowoven|reflow oven]]. We also have a few unsupported capabilities, | ||