Differences

This shows you the differences between two versions of the page.

--- start [2024/03/03 12:49] – [PCB Fabrication] benh
+++ start [2024/04/29 14:48] (current) – [PCB Fabrication] benh
@@ Line 98: / Line 98: @@
   * [[pcb-help_pm|The LPKF ProtoMat S103]] - a 2.5-dimensional plotter that drills and mills (cuts) PCB substrates, plastics, and soft metals
   * [[pcb-help_pl|The LPKF ProtoLaser U4]] - a 20um-diameter laser to etch (selectively remove) a wide variety of film/substrate pairings
-  * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic galvanic electroplater for via formation and other copper/tin plating needs. ** The electroplater works, but the quality is no longer guaranteed by The Hive.**
+  * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic galvanic electroplater for via formation and other copper/tin plating needs. ** The electroplater works, but the quality is no longer guaranteed by The Hive, and we are actively suggesting that students look for alternative options, such as 1mm through-holes or no-via designs.**
 We also can [[process_stencils|cut stencils]] from polyamide or PET sheets (for stainless, see the laser cutting area), and assemble boards with a [[process_reflowoven|reflow oven]]. We also have a few unsupported capabilities, including applying [[https://www.lpkfusa.com/datasheets/prototyping/promask.pdf|soldermask]] and [[https://www.lpkfusa.com/datasheets/prototyping/prolegend.pdf|silkscreen]], a less-complicated [[https://wiki.hive.ece.gatech.edu/doku.php?id=process_kaptonmask|psuedo-masking process]], as well as a [[https://www.lpkfusa.com/datasheets/prototyping/ProConduct_Specs.pdf|chemical-free electroplating]] process, but again, your mileage may vary with these. Head to our [[pcb-fab|PCB fabrication]] page for more details.