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| process_reflowoven [2022/06/12 15:37] – benh | process_reflowoven [2022/09/02 12:48] (current) – benh |
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| ===Advanced reflow use=== | ===Advanced reflow use (i.e. using the software)=== |
| The reflow oven is a pretty simple tool, especially if you're using the standard recipes. However, the software allows additional functionalities to be taken advantage of. The software is called **FlowShow**, and can be launched from the main taskbar on the desktop to the right of the oven. The manual for the software is in the bookmarks bar of the Edge browser. | The reflow oven is a pretty simple tool, especially if you're using the standard recipes. However, the software allows additional functionalities to be taken advantage of. The software is called **FlowShow**, and can be launched from the main taskbar on the desktop to the right of the oven. The computer should be on, so just press the monitor's power button (lower left of the screen); if the computer is off, you can power it on and it should automatically log in. The manual for the software is in the bookmarks bar of the Edge browser. |
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| {{ ::flowshow_mainwindow.png?direct&400|}} | {{ ::flowshow_mainwindow.png?direct&400|}} |
| There are three tabs of operations. The main tab, "Profile recording", allows the user to monitor the temperature during tool use, and to record the temperature profile. **NOTE** that the "Start" button only starts the recording, //not// the process! Similarly, the "Stop" button does not stop the process, only the recording. There are seven temperature sensors in the tool: three are built-in, but four, the "Profile recorder" ones, are thermistors that can be positioned as desired within the oven itself, and can be useful for precision reflow processes where the temperature across the board is critical, or for sensitive components. These four can be found within the main oven drawer (the green wires; see image above). Be careful not to pull them too hard. Kapton tape is effective at keeping them in place over the duration of a process. | There are three tabs of operations. The main tab, "Profile recording", allows the user to monitor the temperature during tool use, and to record the temperature profile. **NOTE** that the "Start" button only starts the recording, //not// the process! Similarly, the "Stop" button does not stop the process, only the recording. There are seven temperature sensors in the tool: three are built-in, but four, the "Profile recorder" ones, are thermocouples that can be positioned as desired within the oven itself, and can be useful for precision reflow processes where the temperature across the board is critical, or for sensitive components. These four can be found either within the main oven drawer (the green wires; see image above), or disconnected and sitting next to the tool. Be careful not to pull them too hard. Kapton tape is effective at keeping them in place over the duration of a process. It's recommended that you position and attach them to your board prior to placing it into the tool (i.e. have them disconnected and outside the tool, tape the ends down onto your board, place the board into the tool carefully at the assigned time, plug the thermocouples in inside the front door near the floor of the tool, and then close the door to start the process). |
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| The middle tab, "Profile programming", is where custom profiles may be created. **YOU MAY ONLY ADJUST PROFILE 12, "CHANGETHIS"!** Please do not mess with the other profiles at this time. Adjusting the profile is as easy as changing the numbers and times around, but if you do this without careful consideration sand knowledge, you can seriously damage or ruin your board and components outright. | The middle tab, "Profile programming", is where custom profiles may be created. **ONLY ADJUST PROFILES 12 ("CHANGETHIS") AND ABOVE (USER01 - USER17)!!** Please do not mess with the other profiles at this time. Adjusting the profile is as easy as changing the numbers and times around, but if you do this without careful consideration sand knowledge, you can seriously damage or ruin your board and components outright. |
| {{::flowshow_profileprogramming.png?direct&400 |}} | {{::flowshow_profileprogramming.png?direct&400 |}} |
| Reflow can typically be separated into three stages: preheating, reflow, and cool-down. The machine has a built-in "optimized" heating ramp up that's given in the upper-right corner of the software. It's generally a good idea to follow this unless your process requires more rapid heating or cooling. Preheating brings the board and components and solder paste to a uniform temperature, and usually involves a soak at that temperature to ensure uniformity. The reflow is when the temperature is brought above the solder's liquidus point, where it transforms into a liquid. Most components don't like being that hot, so the amount of time at those high temperatures should be limited. Finally, there's a cool-down back to "ambient" temperature. Cooling-down too rapidly can also damage the board due to thermal shocks, so it's a good idea to leave this as is as well. | Reflow can typically be separated into three stages: preheating, reflow, and cool-down. The machine has a built-in "optimized" heating ramp up that's given in the upper-right corner of the software. It's generally a good idea to follow this unless your process requires more rapid heating or cooling. Preheating brings the board and components and solder paste to a uniform temperature, and usually involves a soak at that temperature to ensure uniformity. The reflow is when the temperature is brought above the solder's liquidus point, where it transforms into a liquid. Most components don't like being that hot, so the amount of time at those high temperatures should be limited. Finally, there's a cool-down back to "ambient" temperature. Cooling-down too rapidly can also damage the board due to thermal shocks, so it's a good idea to leave this as is as well. |