Differences
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process_2s-plate [2022/07/15 17:47] – benh | process_2s-plate [2022/09/07 15:18] (current) – benh | ||
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* The ProtoMat will pause at a step called " | * The ProtoMat will pause at a step called " | ||
- | * Once it reaches that point, remove the substrate from the ProtoMat and click " | + | * Once it reaches that point, remove the substrate from the ProtoMat and click " |
* Continue with Step 2. | * Continue with Step 2. | ||
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\\ | \\ | ||
//Quick Plating Tips//: | //Quick Plating Tips//: | ||
- | * If you would like to adjust the plating time, ask a PI to put you in touch with an MPI. | + | * Adjusting the plating time can be done if you need a different thickness of copper rather than the standard 18um. If you would like to adjust the plating time, contact the MPIs at < |
* Do not let your substrate sit in the bath (any bath) for very long after the timer runs out. | * Do not let your substrate sit in the bath (any bath) for very long after the timer runs out. | ||
* If the machine throws an error on startup, it’s likely a bath needs to be topped off. Get a PI to help. | * If the machine throws an error on startup, it’s likely a bath needs to be topped off. Get a PI to help. | ||
- | * After bath 3 (activator): | + | * Don't forget to stir bath 3 prior to use! At least 3 minutes, about 200 end-to-end strokes. |
- | * Swipe a “reasonable” amount off with squeegee (mostly just don’t want it dripping) | + | * When rinsing after drying (after “bath 4”), scrub the copper surface with a sponge to remove as much of the dried activator off the copper as possible. |
- | * Cure for 20+ mins at 150F. (Higher than this can cause the ink to bake into the copper.) | + | |
- | * When rinsing after drying (after “bath 4”), scrub the copper surface with a sponge to remove as much of the dried activator off the copper as possible. | + | |
* Scour around your fiducials after plating. It makes a noticeable difference to the laser. | * Scour around your fiducials after plating. It makes a noticeable difference to the laser. | ||