process_2s-plate

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
process_2s-plate [2022/07/15 17:47] benhprocess_2s-plate [2022/09/07 15:18] (current) benh
Line 16: Line 16:
  
   * The ProtoMat will pause at a step called "Dismount Material"   * The ProtoMat will pause at a step called "Dismount Material"
-  * Once it reaches that point, remove the substrate from the ProtoMat and click "Abort" in the Wizard.+  * Once it reaches that point, remove the substrate from the ProtoMat and click "Abort" in the Wizard. (Note that in the electroplater training video, we don't do this, but doing this will save you some time if you follow these guides.)
   * Continue with Step 2.   * Continue with Step 2.
  
Line 22: Line 22:
 \\ \\
 //Quick Plating Tips//: //Quick Plating Tips//:
-  * If you would like to adjust the plating time, ask a PI to put you in touch with an MPI.+  * Adjusting the plating time can be done if you need a different thickness of copper rather than the standard 18um. If you would like to adjust the plating time, contact the MPIs at <hive-pcb@ece.gatech.edu>.
   * Do not let your substrate sit in the bath (any bath) for very long after the timer runs out.   * Do not let your substrate sit in the bath (any bath) for very long after the timer runs out.
   * If the machine throws an error on startup, it’s likely a bath needs to be topped off. Get a PI to help.   * If the machine throws an error on startup, it’s likely a bath needs to be topped off. Get a PI to help.
-  * After bath 3 (activator): +  * Don't forget to stir bath 3 prior to use! At least 3 minutes, about 200 end-to-end strokes
-    * Swipe a “reasonable” amount off with squeegee (mostly just don’t want it dripping) +  * When rinsing after drying (after “bath 4”), scrub the copper surface with a sponge to remove as much of the dried activator off the copper as possible.
-    * Cure for 20+ mins at 150F. (Higher than this can cause the ink to bake into the copper.) +
-    * When rinsing after drying (after “bath 4”), scrub the copper surface with a sponge to remove as much of the dried activator off the copper as possible.+
   * Scour around your fiducials after plating. It makes a noticeable difference to the laser.   * Scour around your fiducials after plating. It makes a noticeable difference to the laser.
  
  • process_2s-plate.txt
  • Last modified: 2022/09/07 15:18
  • by benh