process_1s-noholes

This is an old revision of the document!


This process uses the ProtoLaser only to etch a single side of substrate and cut the board out. It is strongly advised not to attempt any holes using this process, including fiducials! The ProtoLaser is, frankly, not good at making holes, and you’ll be sad when your parts don’t fit.

The other thing to be aware of is that you’ll need to push quite hard to remove the board out of the substrate. For thinner substrates, this might be damaging, so carefully consider what you need before starting this.

Single-sided, no drills process

  • process_1s-noholes.1611080040.txt.gz
  • Last modified: 2021/01/19 13:14
  • by benh