process_1s-holes

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If you are using a double sided substrate, such as those provided by The Hive, go back to The Guide and run the appropriate two-sided process as normal (with or without plating as needed). Nothing will change (including the “Double-sided” option in the Process Planning Wizard). The etch should still be done with the double-sided template because the etch will either isolate the holes on the back-side if you’ve made a bottom-side copper pour/polygon, OR it’ll etch away the entire backside. (Why? Otherwise anything put through the holes may short because of the copper on the backside.) So really, nothing changes at all.

If you have a single sided substrate, meaning copper on only one side, then you can use a single-sided ProtoLaser template, BUT make sure that: (1) when selecting the ProtoLaser template, the “Supported by ProtoMat” box must be checked; and (2) in the ProtoMat setup, still make sure that you select “Double sided” in the Process Planning Wizard. If you don’t, it won’t stop to let you etch before it cuts the board out.

  • process_1s-holes.1610417397.txt.gz
  • Last modified: 2021/01/11 21:09
  • by benh