process_1s-holes

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process_1s-holes [2021/01/13 22:23]
benh
process_1s-holes [2022/07/15 16:39] (current)
benh
Line 7: Line 7:
 **If you have a single sided substrate**,​ meaning copper on only one side, go back to the [[pcb-fab|PCB fabrication]] page and run the appropriate two-sided process (i.e. with or without plating). Note the following: **If you have a single sided substrate**,​ meaning copper on only one side, go back to the [[pcb-fab|PCB fabrication]] page and run the appropriate two-sided process (i.e. with or without plating). Note the following:
   * In the ProtoMat setup, in the Process Planning Wizard (button #1), for "​Substrate layers",​ select “Double sided” as you would for a standard double-sided process. If you don’t, it won’t stop to let you etch before it cuts the board out, and then you'll have to start over since you can't etch safely once you've cut the board out.   * In the ProtoMat setup, in the Process Planning Wizard (button #1), for "​Substrate layers",​ select “Double sided” as you would for a standard double-sided process. If you don’t, it won’t stop to let you etch before it cuts the board out, and then you'll have to start over since you can't etch safely once you've cut the board out.
-  * You will use a single-sided ProtoLaser template (either top or bottom, depending on where your traces are). Make sure the “Supported by ProtoMat” box must be checked.+  * You will use a single-sided ProtoLaser template (either top or bottom, depending on where your traces are). Make sure the “Supported by ProtoMat” box is checked ​in the template window, or else it will try to drill the holes on its own.
  • process_1s-holes.txt
  • Last modified: 2022/07/15 16:39
  • by benh