Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revision | Next revisionBoth sides next revision | ||
pcb-tips [2022/06/25 14:48] – benh | pcb-tips [2022/06/27 11:30] – benh | ||
---|---|---|---|
Line 18: | Line 18: | ||
* Another suggestion for the laser would be to define a metric for etch quality using the aforementioned test design. That way, you can quantitatively determine which parameters are doing better than others. | * Another suggestion for the laser would be to define a metric for etch quality using the aforementioned test design. That way, you can quantitatively determine which parameters are doing better than others. | ||
* For the laser, if you're using a substrate thinner than 5 mil (0.125mm), tabs in your design are a near-requirement! You can make them in the laser. | * For the laser, if you're using a substrate thinner than 5 mil (0.125mm), tabs in your design are a near-requirement! You can make them in the laser. | ||
+ | * Laser cannot do two-sided jobs with plating by itself; the plotter is required for fiducials. No idea why. | ||
[[pcb-book-of-kane|The Book of Kane]] | [[pcb-book-of-kane|The Book of Kane]] |