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pcb-tips [2021/01/17 16:23] – benh | pcb-tips [2021/01/21 09:37] – benh | ||
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* Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through and soldered on both the top and bottom. | * Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through and soldered on both the top and bottom. | ||
* Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time because more of the substrate will be etched. " | * Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time because more of the substrate will be etched. " | ||
- | * We haven' | + | * Slots! |
- | * If you're interested in optimizing your ProtoLaser experience, see the [[https://drive.google.com/file/d/1rF-XXszzSLil9l0rhl82kTUsCyUagpYU/view?usp=sharing|LPKF ProtoLaser Optimization]] document for more information. | + | * If you're interested in optimizing your ProtoLaser experience, see the [[https://gtvault.sharepoint.com/:b:/s/HiveMakerspace/EZGQyfhrC0BItpbSxd_rjRQBzDyNWUubu-RCuJr6a3OI9A?e=8kXjaA|LPKF ProtoLaser Optimization]] document for more information. |
[[pcb-book-of-kane|The Book of Kane]] | [[pcb-book-of-kane|The Book of Kane]] |