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pcb-tips [2021/01/14 22:54] – benh | pcb-tips [2022/06/27 11:30] – benh | ||
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==== Miscellaneous processing tips! ==== | ==== Miscellaneous processing tips! ==== | ||
- | //So you made a few boards. Or not! Either way, this is a running list of tips and tricks for users - things to do and things to avoid.//\\ | + | //So you made a few boards. Or not! Either way, this is a running list of tips and tricks for users - things to do and things to avoid. We make no guarantee with any of these, but we have found that they' |
- | * We haven' | ||
* Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through and soldered on both the top and bottom. | * Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through and soldered on both the top and bottom. | ||
* Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time because more of the substrate will be etched. " | * Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time because more of the substrate will be etched. " | ||
+ | * Slots! We can do them! There are probably a couple of methods for doing this, but the way we've had success is to add the slots onto the " | ||
+ | * If you're interested in optimizing your ProtoLaser experience, see the [[https:// | ||
+ | * Laser precision is dictated by many things, some (even many) of which are likely beyond your control as a user. Here is a completely-uncomplete list of some of these things (a * indicates things that you, as a user, will not be able to adjust, but get in touch if you think it's a major contributor to any issues you're seeing): | ||
+ | * Flatness of your substrate | ||
+ | * Laser power and other material-specific settings | ||
+ | * Design choices (e.g. spacing, trace widths, substrate, copper thickness, etc.) | ||
+ | * Position of the design on the substrate (left, right, center, etc.) | ||
+ | * Cleanliness of the laser lens* | ||
+ | * Level-ness of the floor* | ||
+ | * Level-ness of the sample plate* | ||
+ | * Filter cleanliness* | ||
+ | * One way to minimize systematic errors from the laser system itself is to do what might be termed a "dose test". This would involve make a very small design that has one or more features at and/or around your actual design' | ||
+ | * Another suggestion for the laser would be to define a metric for etch quality using the aforementioned test design. That way, you can quantitatively determine which parameters are doing better than others. | ||
+ | * For the laser, if you're using a substrate thinner than 5 mil (0.125mm), tabs in your design are a near-requirement! You can make them in the laser. | ||
+ | * Laser cannot do two-sided jobs with plating by itself; the plotter is required for fiducials. No idea why. | ||
[[pcb-book-of-kane|The Book of Kane]] | [[pcb-book-of-kane|The Book of Kane]] |