pcb-help_fab

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pcb-help_fab [2021/01/13 22:16] – created benhpcb-help_fab [2022/03/02 22:55] (current) – benh
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-I’m ready to have my board professional fabricated. Do you have any recommendations? +==== Knowledge Base: General Fabrication ====
-We don’t officially recommend any of the following fabrication houses. All of them have positives and negatives. +
  
 +=== Table of Contents ===
 +  - Is there a recommended DRC/CAM file I can use?
 +  - Do I have to be with my board during the entire fabrication process?
 +  - How long does it take to make a board?
 +  - How long does electroplating take?
 +  - Can I somehow reserve time on the equipment?
 +  - Can I add soldermask or silkscreen?
 +  - How do you handle slots? Can you do plated slots?
 +  - Do the tools have additional capabilities?
 +  - Do the tools have additional capabilities?
 +  - Process capabilities and specifications
  
-Some additional notes on board design and fabrication: +----
-  * Slots are hard in this process. Please consider using a single drill hit that’s wide enough if possible. If it’s unavoidable, the current recommended option is to use overlapping drill hits. +
-  * Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through and soldered on both the top and bottom.  +
-  * Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time. +
- +
-Slots\\ +
-Substrate thickness +
- +
-===Fabrication=== +
- +
-** Process specifications **\\ +
-The Hive's PCB fabrication tool suite has the following capabilites: +
-  * //Substrates:// FR4, Rogers materials, polyamide, among many others. +
-  * //Copper thickness/weight:// No limit, other than processing time. +
-  * //Trace width (minimum):// 2 mil (0.05 mm) +
-  * //Trace pitch (minimum):// 1 mil (0.025 mm) +
-  * //Drill holes (minimum diameter):// 6 mil (0.15 mm)  +
-  * //Slot:// yes, use overlapping drill hits +
-  * //Plating:// yes, standard processing time of 3 hours will plate approximately 12.6 um of copper +
- +
-** Can I add soldermask or silkscreen? **\\ +
-We have the capability to apply soldermask and silkscreen, though we //do not// recommend attempting this process - it's time-consuming, UV- and temperature-sensitive, and unnecessary to a complete circuit board. If you need soldermask or silkscreen, consider sending your design to a professional fabrication facility.  +
- +
-For those who would like to attempt this, instructions are available on our [[pcb-mask-silkscreen-SOP| mask and silkscreen]] page, as well as in the "Manuals/Instructions" drawer next to the tools themselves. +
  
 **Is there a recommended DRC/CAM file I can use?**\\ **Is there a recommended DRC/CAM file I can use?**\\
 Yes!  Yes! 
-  - [[https://drive.google.com/open?id=1YITdTXkcW3ROWZprw-xxPsB8okc73yqF|DRC]] +  - [[https://gtvault.sharepoint.com/:u:/s/HiveMakerspace/EcsX-TmZDjdAqs04vOmeMnsBMNtkBI42AUU6yQv-2csZ9Q?e=0PVVEq|DRC]] 
-  - [[https://drive.google.com/open?id=1WzzpPwXMDUg5DD4iUzenZINrzRG0kSn4|CAM]]+  - [[https://gtvault.sharepoint.com/:u:/s/HiveMakerspace/EU8Xunbz4zRFlrfxYhL9IMEBa9wgOJDb8z4tkcOyN8Sf4A?e=LZ2J7h|CAM]]
  
 **Do I have to be with my board during the entire fabrication process?**\\ **Do I have to be with my board during the entire fabrication process?**\\
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 **Can I somehow reserve time on the equipment?**\\ **Can I somehow reserve time on the equipment?**\\
-Yes! Although you are not required to, we //highly// recommend that you do as it guarantees equipment priority. You may reserve time up to 96 hours in advance though SUMS. See the SUMS Guide for more details.+Yes! Although you are not required to, we //highly// recommend that you do as it guarantees equipment priority. You may reserve time up to 96 hours in advance though SUMS. 
   - Go to sums.gatech.edu and login (button is on the top right of the screen).   - Go to sums.gatech.edu and login (button is on the top right of the screen).
   - In the main toolbar on top, on the right, click "Set Active BG/EG". Make sure your Billing Group is "Interdisciplinary Design Commons" and your Equipment Group is "The Hive".   - In the main toolbar on top, on the right, click "Set Active BG/EG". Make sure your Billing Group is "Interdisciplinary Design Commons" and your Equipment Group is "The Hive".
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   * Non-PIs (i.e. those who are not volunteers at The Hive) may schedule a maximum of 4 hour block per tool per day during The Hive’s open hours, and up to 4 days in advance.   * Non-PIs (i.e. those who are not volunteers at The Hive) may schedule a maximum of 4 hour block per tool per day during The Hive’s open hours, and up to 4 days in advance.
   * PI’s may schedule up to 8 hours per tool per day, up to 7 days in advance.   * PI’s may schedule up to 8 hours per tool per day, up to 7 days in advance.
 +
 +** Can I add soldermask or silkscreen? **\\
 +We have the capability to apply soldermask and silkscreen, though we //do not// recommend attempting this process - it's time-consuming, UV- and temperature-sensitive, and unnecessary to a complete circuit board. If you need soldermask or silkscreen, consider sending your design to a professional fabrication facility. 
 +
 +For those who would like to attempt this, instructions are available on our [[pcb-mask-silkscreen-SOP| mask and silkscreen]] page, as well as in the "Manuals/Instructions" drawer next to the tools themselves. 
 +
 +We ALSO have an alternative process to use Kapton tape to make a soldermask-like covering on your board. Definite a YMMV-situation, but [[process_kaptonmask|the instructions are here]]. 
 +
 +** How do you handle slots? Can you do plated slots? **\\
 +Unplated slots are indeed do-able in this process. There are probably a couple of methods for doing this, but the way we've had success is to add the slots onto the "BoardOutline" layer in the software. How this happens depends on your EDA (CAD) software, but in essence, you either need to have your slot in a new gerber (which you can assign to "BoardOutline" in the Import step) or you need to put your slots onto the layer in your EDA that spits out your Board Outline gerber file (in Eagle, this layer is called "Dimensions"). If you need help with this, let us know.
 +
 +Alternatively, you can use the overlapping-drill-hits method, where you just define a number of overlapping drill holes in your CAD. Some CAD programs don't like this, however. 
 +
 +Unfortunately, we haven't found a good way to do plated slots because in the above method, the slot is made //after// the etching is done (and therefore after the plating would be done). An alternative in this case would be to design your slot as overlapping drill hits which are done prior to plating.
  
 ** Do the tools have additional capabilities? **\\  ** Do the tools have additional capabilities? **\\ 
-//NOTE: The following capabilities are allowed in the spec of the tool, but we do not support these functions, meaning that our PIs and MPIs do not have experience with them, so you will be on your own if you attempt any of them!//\\ +Many! See the [[pch-help|Knowledge Base]] page for these, as they're often listed in various bits of documentation that would be out of place on this page. We encourage our users to explore the capabilities of the tools beyond our guides, and beyond even what we list in our documentation. However, while such capabilities are technically allowed in the spec of the tool, we do not officially support anything beyond standard PCB fabrication, meaning that our PIs and MPIs do not have experience with them, so you will be on your own if you attempt any of them!
-The ProtoMat has the capability to do aluminum and plastic 2-dimensional milling. The ProtoLaser can etch a very wide variety of substrates and films. The electroplater has the ability to do tin plating (though we don't carry the necessary solution by default). We also have the LPKF ProConduct system that enables manual electropating of individual vias for RF PCBs (proceed with caution here). +
  
-The full suit includes the following:+** Process capabilities and specifications **\\ 
 +The full suite of LPKF tools at The Hive includes the following:
   * LPKF ProtoMat S103 ([[https://www.lpkfusa.com/datasheets/prototyping/s103.pdf|datasheet]]) - drilling, milling, and routing   * LPKF ProtoMat S103 ([[https://www.lpkfusa.com/datasheets/prototyping/s103.pdf|datasheet]]) - drilling, milling, and routing
   * LPKF ProtoLaser U4 ([[https://www.lpkf.com/fileadmin/mediafiles/user_upload/products/pdf/DQ/brochure_lpkf_protolaser_u4_en.pdf|datasheet]]) - etching, cutting   * LPKF ProtoLaser U4 ([[https://www.lpkf.com/fileadmin/mediafiles/user_upload/products/pdf/DQ/brochure_lpkf_protolaser_u4_en.pdf|datasheet]]) - etching, cutting
   * LPKF Contac S4 ([[https://www.lpkf.com/fileadmin/mediafiles/user_upload/products/pdf/DQ/flyer_lpkf_contac_s4_en.pdf|datasheet]]) - electroplating   * LPKF Contac S4 ([[https://www.lpkf.com/fileadmin/mediafiles/user_upload/products/pdf/DQ/flyer_lpkf_contac_s4_en.pdf|datasheet]]) - electroplating
-  * LPKF ProMask ([[https://www.lpkfusa.com/datasheets/prototyping/promask.pdf|datasheet]]) - Soldermask+  * LPKF ProMask ([[https://www.lpkfusa.com/datasheets/prototyping/promask.pdf|datasheet]]) - Soldermask ([[process_kaptonmask|Kapton-tape alternative]])
   * LPKF ProLegend ([[https://www.lpkfusa.com/datasheets/prototyping/prolegend.pdf|datasheet]]) - Silkscreen   * LPKF ProLegend ([[https://www.lpkfusa.com/datasheets/prototyping/prolegend.pdf|datasheet]]) - Silkscreen
-  * LPKF ProtoPrint S ([[https://www.lpkfusa.com/datasheets/prototyping/zelprint.pdf|datasheet]]) - Solderpaste stencil holder +  * LPKF ProtoPrint S ([[https://www.lpkfusa.com/datasheets/prototyping/zelprint.pdf|datasheet]]) - Solderpaste stencil holder ([[process_stencils|How-to]]) 
-  * LPKF ProtoFlow ([[https://www.lpkfusa.com/datasheets/prototyping/protoflow.pdf|datasheet]]) - Reflow oven +  * LPKF ProtoFlow ([[https://www.lpkfusa.com/datasheets/prototyping/protoflow.pdf|datasheet]]) - Reflow oven ([[process_reflowOven|How-to]]) 
-  * LPKF ProConduct ([[https://www.lpkfusa.com/datasheets/prototyping/ProConduct_Specs.pdf|datasheet]] - Plating for RF applications+  * LPKF ProConduct ([[https://www.lpkfusa.com/datasheets/prototyping/ProConduct_Specs.pdf|datasheet]] - Chemical-free "plating" for RF applications\\
  
-See our [[pcb-sops|Standard Operating Procedures]] page for further details.+The Hive's PCB fabrication tool suite has the following capabilites: 
 +  * //Substrates:// FR4, Rogers materials, polyamide, among many others. 
 +  * //Copper thickness/weight:// No limit, other than processing time. 
 +  * //Trace width (minimum):// 2 mil (0.05 mm) 
 +  * //Trace pitch (minimum):// 1 mil (0.025 mm) 
 +  * //Drill holes (minimum diameter):// 6 mil (0.15 mm)  
 +  * //Slot:// yes, YMMV 
 +  * //Plating:// yes, both chemical electroplating and chemical-free through-hole coating for RF applications
  
----- 
-=== Process Specifications and Tolerances === 
 If you’re board passes OshPark’s specs ([[https://docs.oshpark.com/design-tools/eagle/design-rules-files|OshPark .dru file]]), it can be made using our process (see their website for details). However, our process can, in fact, go beyond that in some ways.  If you’re board passes OshPark’s specs ([[https://docs.oshpark.com/design-tools/eagle/design-rules-files|OshPark .dru file]]), it can be made using our process (see their website for details). However, our process can, in fact, go beyond that in some ways. 
  
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  • Last modified: 2021/01/13 22:16
  • by benh