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pcb-help [2021/01/13 21:44] – benhpcb-help [2022/07/13 21:18] (current) – benh
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-What if I have a single-sided design WITH holes? +==== Knowledge Base ==== 
-If you are using a double sided substrate, such as those provided by The Hive, run the appropriate two-sided process as normal (without plating or with plating). Nothing will change (including the “Double-sided” option in the Process Planning Wizard). The etch should still be done with the double-sided template because the etch will either isolate the holes on the back-side if you’ve made a bottom-side copper pour/polygon, OR it’ll etch away the entire backside. (Why? Otherwise anything put through the holes may short because of the copper on the backside.) So really, nothing changes at all.+Where to go if you have general questions about anything.\\ 
 +\\ 
 +It's suggested that, if you're having processing issues, go to the [[pcb-fab|relevant process guide]] first to confirm you're doing things right. Then look at the relevant tool pages (below) for additional details. \\ 
 +\\ 
 +[[pcb-help_fab|General fabrication]], including non-standard process questions.\\ 
 +[[pcb-help_PM|ProtoMat]]\\ 
 +[[pcb-help_PL|ProtoLaser]]\\ 
 +[[pcb-help_EP|Electroplater]]\\ 
 +[[pcb-design|PCB design]]\\ 
 +[[pcb-tips|Fab tips and tricks]]
  
-If you have a single sided substrate, meaning copper on only one side, then you can use a single-sided ProtoLaser template, BUT make sure that: (1) when selecting the ProtoLaser template, the “Supported by ProtoMat” box must be checked; and (2) in the ProtoMat setup, still make sure that you select “Double sided” in the Process Planning Wizard. If you don’t, it won’t stop to let you etch before it cuts the board out. +If you cannot find the answer to your issue here, please reach out to us at hive-pcb@ece.gatech.edu.
- +
-My gerber/drill file didn’t show up on the CAM view. +
-You probably forgot to assign it a layer. Try re-importing the files, and make sure you’ve assigned each file a Layer/Template (see figure 11). +
- +
-The bottom/top didn’t etch completely. +
-You can either restart the process entirely (hit the Play button, see figure 32) or right click on “Top Side” (or “Bottom side”) under “Processing” on the left, and click “Process from here” to restart the top (or bottom) side processing with top (or bottom) side alignment. +
- +
-The pre-toolpath file did not import correctly into the ProtoLaser. +
-It’s likely that you either did not save at the correct point in the process, you saved over the pre-toolpath file, or you are trying to import the wrong file. Double check all of this. If you’re certain you did it correctly, get a PI. +
- +
-The board is/is not flipped in the Processing tab. +
-On the left of the screen, make sure nothing is selected under “Processing”. If there is, hold down either CTRL (on Windows) or the command key (on Mac) and then left click to de-select it. +
- +
-If that doesn’t fix it, you can select either “Bottom Side” or “Top Side” to force the correct orientation. +
- +
-You can try starting the project over again if this doesn’t solve it as well. Sometimes, the software has bugs. +
- +
-ProtoMat - Software cannot connect to the tool +
-Turn on the ProtoMat by toggling the green switch located underneath the cover, to the right of the working table, above the main power cable. The vacuum system will engage and a red light underneath the toolhead will turn on. Then, in the software, in the main toolbar (with the File menu), click “Machining” > “Connect”. Make sure that “S103” is selected in the dropdown menu and click “Connect”. Let the connection process happen, and then try the fabrication again. +
- +
-ProtoLaser - Insufficient pressure +
-Potential issue: The vacuum hose may be disconnected from the extraction hood.  +
-Lift the door. The extraction hood is the plastic bit that the laser comes out of. There is a hose that should run from that to the back of the machine (still all inside the main bay). Make sure that its snugly inserted on both ends. +
-Potential issue: The vacuum system may not be on or working strongly enough. +
-Confirm that the vacuum system is on.The vacuum system is the tall white box to the tool’s right. On the front panel, at the bottom, there should be some buttons. Try increasing the suction pressure. +
-Potential issue: The vacuum hose(s) may be clogged. +
-There are two vacuum hoses. One runs from the extraction hood (the round plastic bit inside the main bay) to the rear interior wall of the tool, and the second runs from the outside backside of the tool to the vacuum system (the tall white box to the tool’s right). You should be able to remove both of these and check for clogs.  +
- +
-Electroplater - Device in failed state on startup +
-Potential issue: Baths 1 and/or 2 are low. +
-Lift the lids to baths 1 and 2. If they are low, get a PI/MPI/Staff to refill from the chemical cabinet in the storage closet in the Semi-clean room. +
- +
-Electroplater - Zero plating current error +
-Potential issue: Too much copper buildup on the PCB holder. +
-Put on the chemical safety gear (apron, goggles, gloves, in that order (Figure 30)) and remove the board from bath 5. Using the drip tray, go to the sink and rinse the drip tray, board, holder, and gloves well. Remove the board from the holder with the allen key. Using a fine-grit sandpaper, file, or sanding block, sand off any copper build-up on the posts and on the metal on the underside. Big flakes of copper may come off; this is expected. Once it looks cleaner, seat the empty holder into an empty bath and screw it down. Get a multimeter. The resistance between either of the posts on the holder and the metal strip that run down the line of baths should be less than 1Ω. If so, re-attach the substrate to the holder, don the chemical gear again, place it back into Bath 5 (and screw it down), and press the play button to continue.  +
-If this does not change it, or you are not comfortable doing this, please get a PI. +
-Potential issue: Insufficient contact between the metal pegs in the tool and the metal underside of the tool holder. +
-Make sure that the tool holder is completely screwed down onto the pegs.  +
-If the toolholder screws will not tighten further but is not in contact with the rail (i.e. there is a gap between the tool holder and the metal side railings), attempt to re-seat the holder onto the pegs.  +
-If that is unsuccessful in solving the issue, don the chemical safety gear, remove the board+holder from bath 5 and, using the drip tray, move to the sink to rinse the board, holder, gloves, and drip tray. Remove the board from the holder with the allen key. Using a wire brush, sandpaper, or other means, clean out the peg holes in the tool holder.  +
- +
-Any other issue not listed here. +
-If you have additional fabrication issues, please find a PI to assist, or email hive-pcb@ece.gatech.edu to reach the PCB MPIs. +
- +
-I’m ready to have my board professional fabricated. Do you have any recommendations? +
-We don’t officially recommend any of the following fabrication houses. All of them have positives and negatives.  +
- +
- +
-Some additional notes on board design and fabrication: +
-  * Slots are hard in this process. Please consider using a single drill hit that’s wide enough if possible. If it’s unavoidable, the current recommended option is to use overlapping drill hits. +
-  * Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through and soldered on both the top and bottom.  +
-  * Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time. +
- +
-Fabrication +
-  * Process specifications  +
-  * Can I add soldermask or silkscreen? +
-  * Is there a recommended DRC/CAM file I can use? +
-  * Do I have to be with my board during the entire fabrication process? +
-  * How long does it take to make a board? +
-  * How long does electroplating take? +
-  * Can I somehow reserve time on the equipment? +
-  * Do the tools have additional capabilities? +
-Slots\\ +
-How to use the PM's Operate tab to re-start projects\\ +
-Substrate thickness +
- +
-===Fabrication=== +
- +
-** Process specifications **\\ +
-The Hive's PCB fabrication tool suite has the following capabilites: +
-  * //Substrates:// FR4, Rogers materials, polyamide, among many others. +
-  * //Copper thickness/weight:// No limit, other than processing time. +
-  * //Trace width (minimum):// 2 mil (0.05 mm) +
-  * //Trace pitch (minimum):// 1 mil (0.025 mm) +
-  * //Drill holes (minimum diameter):// 6 mil (0.15 mm)  +
-  * //Slot:// yes, use overlapping drill hits +
-  * //Plating:// yes, standard processing time of 3 hours will plate approximately 12.6 um of copper +
- +
-** Can I add soldermask or silkscreen? **\\ +
-We have the capability to apply soldermask and silkscreen, though we //do not// recommend attempting this process - it's time-consuming, UV- and temperature-sensitive, and unnecessary to a complete circuit board. If you need soldermask or silkscreen, consider sending your design to a professional fabrication facility.  +
- +
-For those who would like to attempt this, instructions are available on our [[pcb-mask-silkscreen-SOP| mask and silkscreen]] page, as well as in the "Manuals/Instructions" drawer next to the tools themselves.  +
- +
-**Is there a recommended DRC/CAM file I can use?**\\ +
-Yes!  +
-  - [[https://drive.google.com/open?id=1YITdTXkcW3ROWZprw-xxPsB8okc73yqF|DRC]] +
-  - [[https://drive.google.com/open?id=1WzzpPwXMDUg5DD4iUzenZINrzRG0kSn4|CAM]] +
- +
-**Do I have to be with my board during the entire fabrication process?**\\ +
-Yes! You must be present for the entire process. This is for safety reasons. PIs have the authority to cancel any unattended boards. You may, however, leave the space //if and only if// you leave a note with a phone number and accept the possibility that something may happen to your product while you're gone (because PIs are not watching your process).  +
- +
-**How long does it take to make a board?**\\ +
-It depends on the size and layout of your board. A small board with no electroplating (i.e. no vias) can easily be made in under an hour, while a very large board with lots of copper removed can take over 4 hours not including electroplating. +
- +
-**How long does electroplating take?**\\ +
-Between 2 and 3 hours, regardless of board size. This will plate between 8-15 um of copper onto your surfaces. Less than this processing time can cause unreliable vias with variable thickness of the plating.  +
- +
-**Can I somehow reserve time on the equipment?**\\ +
-Yes! Although you are not required to, we //highly// recommend that you do as it guarantees equipment priority. You may reserve time up to 96 hours in advance though SUMS. See the SUMS Guide for more details. +
-  - Go to sums.gatech.edu and login (button is on the top right of the screen). +
-  - In the main toolbar on top, on the right, click "Set Active BG/EG". Make sure your Billing Group is "Interdisciplinary Design Commons" and your Equipment Group is "The Hive". +
-  - On the main page, locate the Schedule section. Under the drop-down menu that says, “My Schedule - Select a tool to schedule time”, select the tool in question. Note that you cannot reserve time on a tool until you have completed training for it. +
-  - Click and drag on the calendar itself to reserve time. Release the mouse button to bring up the reservation screen. You must enter a description in order to reserve time! Click “Save” to save the reservation. +
- +
-We highly advise you to schedule time on all the tools you’ll need, i.e. if you’re fabricating a standard board, you should reserve time on both the Plotter and the Laser. If you do not, and someone schedules time on only the laser, they have priority on the tool. +
- +
-//Reservations are limited to the following:// +
-  * Non-PIs (i.e. those who are not volunteers at The Hive) may schedule a maximum of 4 hour block per tool per day during The Hive’s open hours, and up to 4 days in advance. +
-  * PI’s may schedule up to 8 hours per tool per day, up to 7 days in advance. +
- +
-** Do the tools have additional capabilities? **\\  +
-//NOTE: The following capabilities are allowed in the spec of the tool, but we do not support these functions, meaning that our PIs and MPIs do not have experience with them, so you will be on your own if you attempt any of them!//\\ +
-The ProtoMat has the capability to do aluminum and plastic 2-dimensional milling. The ProtoLaser can etch a very wide variety of substrates and films. The electroplater has the ability to do tin plating (though we don't carry the necessary solution by default). We also have the LPKF ProConduct system that enables manual electropating of individual vias for RF PCBs (proceed with caution here). +
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  • Last modified: 2021/01/13 21:44
  • by benh