Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
pcb-fab [2021/01/13 23:28] – benh | pcb-fab [2022/09/07 17:55] (current) – benh | ||
---|---|---|---|
Line 1: | Line 1: | ||
==== PCB Fabrication ==== | ==== PCB Fabrication ==== | ||
+ | === Table of Contents === | ||
+ | - General processing reminders | ||
+ | - Process Guides | ||
+ | - Process Capabilites | ||
+ | - Process Specifications and Tolerances | ||
- | === Reminders...=== | + | ---- |
+ | === General Processing | ||
* Orient all your boards *before* creating any fiducials. | * Orient all your boards *before* creating any fiducials. | ||
* 4 fiducials – always. | * 4 fiducials – always. | ||
* Don't forget to save before generating the toolpath on the ProtoMat! | * Don't forget to save before generating the toolpath on the ProtoMat! | ||
+ | * Make sure that the two boxes are checked before selecting a ProtoLaser template. | ||
* Do not forget the chemical safety gear when electroplating. | * Do not forget the chemical safety gear when electroplating. | ||
+ | * ** Get a PI to change any bits in the ProtoMat!** | ||
---- | ---- | ||
=== Process Guides === | === Process Guides === | ||
- | - [[process_1S-noHoles|Single sided, no holes]] | + | - [[process_1S-noHoles|Single sided design, no holes]], regardless of plating. |
- | - [[process_1S-holes|Single sided, with holes]] | + | - [[process_1S-holes|Single sided design, with holes]], regardless of plating. |
- | - [[process_2S-noPlate|Double sided, no plating]] | + | - [[process_2S-noPlate|Double sided, no plating]], regardless of hole count. |
- | - [[process_2S-plate|Double sided, with plating]] | + | - [[process_2S-plate|Double sided, with plating]], regardless of hole count. |
+ | - [[process_stencils|Solderpaste stencils]] | ||
+ | - [[process_reflowOven|Reflow oven]] | ||
+ | - [[process_kaptonmask|Kapton tape soldermasking]] // | ||
- | **HELP!** --> | + | **HELP!** --> |
- | ---- | + | \\ |
- | The above guides | + | See our [[pcb-tips|tips and tricks]] page for some advanced processing concepts (or just interesting tidbits).\\ |
+ | \\ | ||
+ | //The above guides | ||
---- | ---- | ||
=== Process Capabilities === | === Process Capabilities === | ||
- | The Hive has a suite of LPKF tools that enable students to fabricate 2-layer prototype-quality PCBs with fully-plated vias on campus. With additional setup, they can also apply soldermask and silkscreen for a production-quality finish, cut a solder paste stencil for part placement, and a reflow solder the components to the board. The tools have numerous additional capabilities beyond simple PCB fabrication, | + | The Hive has a suite of LPKF tools that enable students to fabricate 2-layer prototype-quality PCBs with fully-plated vias on campus. With additional setup, they can also apply soldermask and silkscreen for a production-quality finish, cut a solder paste stencil for part placement, and a reflow solder the components to the board. The tools have numerous additional capabilities beyond simple PCB fabrication, |
The Hive's PCB fabrication tool suite has the following capabilities: | The Hive's PCB fabrication tool suite has the following capabilities: | ||
- | * // | + | * // |
- | * //Copper thickness/ | + | * //Copper thickness/ |
- | * //Slot:// yes, using overlapping drill hits | + | * //Slot:// yes, but YMMV. See our [[pcb-tips|fabs tips]] page for details. |
- | * //Plating:// yes, standard processing time of 3 hours will plate approximately | + | * //Electroplating:// yes, standard processing time of 3 hours will plate approximately |
+ | * // | ||
+ | * // | ||
+ | * // | ||
+ | * //Reflow:// we have a fully operational reflow oven, optimized for lead-free solder paste. See " | ||
+ | * Our [[pcb-help|knowledge base]] is pretty extensive as well, so check that for answers to many questions and processing help. | ||
The full suit includes the following: | The full suit includes the following: | ||
- | * LPKF ProtoMat S103 ([[https:// | + | * LPKF ProtoMat S103 ([[https:// |
- | * LPKF ProtoLaser U4 ([[https:// | + | * LPKF ProtoLaser U4 ([[https:// |
- | * LPKF Contac S4 ([[https:// | + | * LPKF Contac S4 ([[https:// |
- | * LPKF ProMask ([[https:// | + | * LPKF ProMask ([[https:// |
- | * LPKF ProLegend ([[https:// | + | * LPKF ProLegend ([[https:// |
- | * LPKF ProtoPrint S ([[https:// | + | * LPKF ProtoPrint S ([[https:// |
- | * LPKF ProtoFlow ([[https:// | + | * LPKF ProtoFlow ([[https:// |
- | * LPKF ProConduct ([[https:// | + | * LPKF ProConduct ([[https:// |
- | + | ||
- | See our [[pcb-sops|Standard Operating Procedures]] page for further details. | + | |
---- | ---- | ||
=== Process Specifications and Tolerances === | === Process Specifications and Tolerances === | ||
- | If you’re board passes OshPark’s specs ([[https:// | + | If you’re board passes OshPark’s specs ([[https:// |
- | ^ Specification ^ Minimum/Theoretical ^ Recommended ^ | + | ^ Specification ^ Theoretical |
- | | Trace width | + | | Trace width |
- | | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 6 mils (0.15 mm) | | + | | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 5 mils (0.15 mm) | |
- | | Polygon isolation | 10 mils (0.25 mm) | 30 mils (0.75 mm) | | + | | Polygon isolation | 10 mils (0.25 mm) | 24 mils (0.75 mm) | |
| Drill hit | 6 mil (0.15 mm) | 15 mil (0.4 mm) | | | Drill hit | 6 mil (0.15 mm) | 15 mil (0.4 mm) | | ||
| Drill X/Y resolution | +/- 0.01 mil (0.25 μm) || | | Drill X/Y resolution | +/- 0.01 mil (0.25 μm) || | ||
Line 54: | Line 70: | ||
| Drill hit | 0.05 mil (1.2 μm) || | | Drill hit | 0.05 mil (1.2 μm) || | ||
- | See our [[pcb-help|Knowledge Base]] for more fabrication-related tips, tricks, | + | **Note:** If you're considering a design at our theoretical minimum capabilities, |