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| pcb-fab [2022/09/02 12:51] – benh | pcb-fab [2022/09/07 17:55] (current) – benh |
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| * //Copper thickness/weight:// No known limit, other than processing time. | * //Copper thickness/weight:// No known limit, other than processing time. |
| * //Slot:// yes, but YMMV. See our [[pcb-tips|fabs tips]] page for details. | * //Slot:// yes, but YMMV. See our [[pcb-tips|fabs tips]] page for details. |
| * //Electroplating:// yes, standard processing time of 3 hours will plate approximately 16 um of copper. We also have a chemical-free non-electrical "plating" process with the ProConduct package. See our [[pcb-help_ep|electroplater help page]] for details. //Note that as of Feb 2022, the electroplater is still down. We continue to work with LPKF on a solution.// | * //Electroplating:// yes, standard processing time of 3 hours will plate approximately 16 um of copper. We also have a chemical-free non-electrical "plating" process with the ProConduct package. See our [[pcb-help_ep|electroplater help page]] for details. |
| * //Soldermask:// we have the chemicals, which have an official process, but we don't officially support it. See the ProMask datasheet, below. We also have trialed an alternative masking process with Kapton tape, but YMMV. See [[process_kaptonmask|this page]] for more details. | * //Soldermask:// we have the chemicals, which have an official process, but we don't officially support it. See the ProMask datasheet, below. We also have trialed an alternative masking process with Kapton tape, but YMMV. See [[process_kaptonmask|this page]] for more details. |
| * //Silkscreen:// we have the chemicals, which have an official process, but we don't officially support it. See the ProLegend datasheet below. | * //Silkscreen:// we have the chemicals, which have an official process, but we don't officially support it. See the ProLegend datasheet below. |
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| === Process Specifications and Tolerances === | === Process Specifications and Tolerances === |
| If you’re board passes OshPark’s specs ([[https://docs.oshpark.com/design-tools/eagle/design-rules-files|OshPark .dru file]]), it can be made using our process (see their website for details). However, our process can, in fact, go beyond that in some ways. See the | If you’re board passes OshPark’s specs ([[https://docs.oshpark.com/design-tools/eagle/design-rules-files|OshPark .dru file]]), it can be made using our process (see their website for details). However, our process can, in fact, go beyond that in some ways. See our [[pcb-help|Knowledge Base]] and [[pcb-tips|Tips and Tricks]] pages for additional information. |
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| ^ Specification ^ Theoretical Minimum ^ Recommended Minimum ^ | ^ Specification ^ Theoretical Minimum (see note below) ^ Recommended Minimum ^ |
| | Trace width | 1 mils (0.05 mm) | 5 mils (0.25 mm) | | | Trace width | 1 mils (0.05 mm) | 5 mils (0.25 mm) | |
| | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 5 mils (0.15 mm) | | | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 5 mils (0.15 mm) | |
| | Laser repeatability | 0.08 mils (2 μm) || | | Laser repeatability | 0.08 mils (2 μm) || |
| | Drill hit | 0.05 mil (1.2 μm) || | | Drill hit | 0.05 mil (1.2 μm) || |
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| See our [[pcb-help|Knowledge Base]] and [[pcb-tips|Tips and Tricks]] pages for additional information. | |
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| **Note:** If you're considering a design at our theoretical minimum capabilities, first strongly consider whether you need that level of precision. If the answer is still yes, go to the [[pcb-help_pl|ProtoLaser]] (for etching) and [[pcb-help_pm|ProtoMat]] (for drilling) help sections for advice on reaching those new lows. | **Note:** If you're considering a design at our theoretical minimum capabilities, first strongly consider whether you need that level of precision. If the answer is still yes, go to the [[pcb-help_pl|ProtoLaser]] (for etching) and [[pcb-help_pm|ProtoMat]] (for drilling) help sections for advice on reaching those new lows. |