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pcb-fab [2022/07/13 16:57] – benh | pcb-fab [2022/09/02 12:51] – benh | ||
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=== Process Guides === | === Process Guides === | ||
- | - [[process_1S-noHoles|Single sided, no holes]] | + | - [[process_1S-noHoles|Single sided design, no holes]], regardless of plating. |
- | - [[process_1S-holes|Single sided, with holes]] | + | - [[process_1S-holes|Single sided design, with holes]], regardless of plating. |
- | - [[process_2S-noPlate|Double sided, no plating]] | + | - [[process_2S-noPlate|Double sided, no plating]], regardless of hole count. |
- | - [[process_2S-plate|Double sided, with plating]] | + | - [[process_2S-plate|Double sided, with plating]], regardless of hole count. |
- [[process_stencils|Solderpaste stencils]] | - [[process_stencils|Solderpaste stencils]] | ||
- [[process_reflowOven|Reflow oven]] | - [[process_reflowOven|Reflow oven]] | ||
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=== Process Specifications and Tolerances === | === Process Specifications and Tolerances === | ||
- | If you’re board passes OshPark’s specs ([[https:// | + | If you’re board passes OshPark’s specs ([[https:// |
- | ^ Specification ^ Theoretical Minimum ^ Recommended Minimum ^ | + | ^ Specification ^ Theoretical Minimum |
| Trace width | 1 mils (0.05 mm) | 5 mils (0.25 mm) | | | Trace width | 1 mils (0.05 mm) | 5 mils (0.25 mm) | | ||
| Trace spacing (“pitch”) | 1 mils (0.025 mm) | 5 mils (0.15 mm) | | | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 5 mils (0.15 mm) | | ||
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| Drill hit | 0.05 mil (1.2 μm) || | | Drill hit | 0.05 mil (1.2 μm) || | ||
- | See our [[pcb-help|Knowledge Base]] and [[pcb-tips|Tips and Tricks]] pages for additional information. | + | **Note:** If you're considering a design at our theoretical minimum capabilities, |
- | + | ||
- | **Note:** If you're considering a design at our theoretical minimum capabilities, | + | |