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==== PCB Fabrication ==== | ==== PCB Fabrication ==== | ||
+ | === Table of Contents === | ||
+ | - General processing reminders | ||
+ | - Process Guides | ||
+ | - Process Capabilites | ||
+ | - Process Specifications and Tolerances | ||
+ | ---- | ||
+ | === General Processing Reminders...=== | ||
+ | * Orient all your boards *before* creating any fiducials. | ||
+ | * 4 fiducials – always. | ||
+ | * Don't forget to save before generating the toolpath on the ProtoMat! | ||
+ | * Make sure that the two boxes are checked before selecting a ProtoLaser template. | ||
+ | * Do not forget the chemical safety gear when electroplating. | ||
+ | * ** Get a PI to change any bits in the ProtoMat!** | ||
+ | |||
+ | ---- | ||
=== Process Guides === | === Process Guides === | ||
- | - [[process_1S-noHoles|Single sided, no holes]] | + | - [[process_1S-noHoles|Single sided design, no holes]], regardless of plating. |
- | - [[process_1S-holes|Single sided, with holes]] | + | - [[process_1S-holes|Single sided design, with holes]], regardless of plating. |
- | - [[process_2S-noPlate|Double sided, no plating]] | + | - [[process_2S-noPlate|Double sided, no plating]], regardless of hole count. |
- | - [[process_2S-plate|Double sided, with plating]] | + | - [[process_2S-plate|Double sided, with plating]], regardless of hole count. |
+ | - [[process_stencils|Solderpaste stencils]] | ||
+ | - [[process_reflowOven|Reflow oven]] | ||
+ | - [[process_kaptonmask|Kapton tape soldermasking]] // | ||
- | **HELP!** --> | + | **HELP!** --> |
- | ---- | + | \\ |
- | The above guides | + | See our [[pcb-tips|tips and tricks]] page for some advanced processing concepts (or just interesting tidbits).\\ |
+ | \\ | ||
+ | //The above guides | ||
---- | ---- | ||
=== Process Capabilities === | === Process Capabilities === | ||
- | The Hive has a suite of LPKF tools that enable students to fabricate 2-layer prototype-quality PCBs with fully-plated vias on campus. With additional setup, they can also apply soldermask and silkscreen for a production-quality finish, cut a solder paste stencil for part placement, and a reflow solder the components to the board. The tools have numerous additional capabilities beyond simple PCB fabrication, | + | The Hive has a suite of LPKF tools that enable students to fabricate 2-layer prototype-quality PCBs with fully-plated vias on campus. With additional setup, they can also apply soldermask and silkscreen for a production-quality finish, cut a solder paste stencil for part placement, and a reflow solder the components to the board. The tools have numerous additional capabilities beyond simple PCB fabrication, |
- | The full suit includes | + | The Hive's PCB fabrication tool suite has the following |
- | * LPKF ProtoMat S103 ([[https://www.lpkfusa.com/datasheets/prototyping/ | + | * //Substrates:// FR4, Rogers materials, polyamide, among many others. See the [[pcb-help_pl|ProtoLaser help page]] for more details. |
- | * LPKF ProtoLaser U4 ([[https://www.lpkf.com/fileadmin/mediafiles/user_upload/products/pdf/DQ/brochure_lpkf_protolaser_u4_en.pdf|datasheet]]) - etching, cutting | + | * //Copper thickness/weight:// No known limit, other than processing time. |
- | * LPKF Contac S4 ([[https://www.lpkf.com/fileadmin/mediafiles/ | + | * //Slot:// yes, but YMMV. See our [[pcb-tips|fabs tips]] page for details. |
- | * LPKF ProMask ([[https://www.lpkfusa.com/ | + | * //Electroplating: |
- | * LPKF ProLegend ([[https://www.lpkfusa.com/datasheets/prototyping/prolegend.pdf|datasheet]]) - Silkscreen | + | * // |
- | * LPKF ProtoPrint S ([[https://www.lpkfusa.com/datasheets/prototyping/ | + | * // |
- | * LPKF ProtoFlow ([[https:// | + | * //Stencils:// we can make them! See our " |
+ | * //Reflow:// we have a fully operational reflow oven, optimized for lead-free solder paste. See " | ||
+ | * Our [[pcb-help|knowledge base]] is pretty extensive as well, so check that for answers to many questions and processing help. | ||
- | See our [[pcb-sops|Standard Operating Procedures]] page for further details. | + | The full suit includes the following: |
+ | * LPKF ProtoMat S103 ([[https:// | ||
+ | * LPKF ProtoLaser U4 ([[https:// | ||
+ | * LPKF Contac S4 ([[https:// | ||
+ | * LPKF ProMask ([[https:// | ||
+ | * LPKF ProLegend ([[https:// | ||
+ | * LPKF ProtoPrint S ([[https:// | ||
+ | * LPKF ProtoFlow ([[https:// | ||
+ | * LPKF ProConduct ([[https:// | ||
---- | ---- | ||
=== Process Specifications and Tolerances === | === Process Specifications and Tolerances === | ||
- | If you’re board passes OshPark’s specs ([[https:// | + | If you’re board passes OshPark’s specs ([[https:// |
- | ^ Specification ^ Minimum/Theoretical ^ Recommended ^ | + | ^ Specification ^ Theoretical |
- | | Trace width | + | | Trace width |
- | | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 6 mils (0.15 mm) | | + | | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 5 mils (0.15 mm) | |
- | | Polygon isolation | 10 mils (0.25 mm) | 30 mils (0.75 mm) | | + | | Polygon isolation | 10 mils (0.25 mm) | 24 mils (0.75 mm) | |
| Drill hit | 6 mil (0.15 mm) | 15 mil (0.4 mm) | | | Drill hit | 6 mil (0.15 mm) | 15 mil (0.4 mm) | | ||
| Drill X/Y resolution | +/- 0.01 mil (0.25 μm) || | | Drill X/Y resolution | +/- 0.01 mil (0.25 μm) || | ||
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| Laser repeatability | 0.08 mils (2 μm) || | | Laser repeatability | 0.08 mils (2 μm) || | ||
| Drill hit | 0.05 mil (1.2 μm) || | | Drill hit | 0.05 mil (1.2 μm) || | ||
- | | Copper Plating Thickness | ~15 um for 2 hour job || | ||
- | See our [[pcb-help_fab|Knowledge Base]] for more fabrication-related tips, tricks, | + | **Note:** If you're considering a design at our theoretical minimum capabilities, |