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| start [2022/06/15 14:22] – benh | start [2022/06/15 14:25] – [PCB Manufacturing] benh | ||
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| * [[pcb-help_pl|The LPKF ProtoLaser U4]] - a 20um-diameter laser to etch (selectively remove) a wide variety of film/ | * [[pcb-help_pl|The LPKF ProtoLaser U4]] - a 20um-diameter laser to etch (selectively remove) a wide variety of film/ | ||
| * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic electroplater for via formation and other copper/tin plating needs | * [[pcb-help_ep|The LPKF Contac S4]] - a semi-automatic electroplater for via formation and other copper/tin plating needs | ||
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| + | We also can cut stencils, apply soldermask and silkscreen (YMMV), and assemble with a reflow oven. | ||
| The Hive provides double-sided copper on FR4 in 0.5 oz/ft^2 (18 um) and 1 oz/ft^2 (35 um) weights to our users at no cost, though many other substrates can be used. | The Hive provides double-sided copper on FR4 in 0.5 oz/ft^2 (18 um) and 1 oz/ft^2 (35 um) weights to our users at no cost, though many other substrates can be used. | ||