process_2s-plate

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process_2s-plate [2021/01/19 13:18] – benhprocess_2s-plate [2021/01/21 09:39] – benh
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     * Cure for 20+ mins at 150F. (Higher than this can cause the ink to bake into the copper.)     * Cure for 20+ mins at 150F. (Higher than this can cause the ink to bake into the copper.)
     * When rinsing after drying (after “bath 4”), scrub the copper surface with a sponge to remove as much of the dried activator off the copper as possible.     * When rinsing after drying (after “bath 4”), scrub the copper surface with a sponge to remove as much of the dried activator off the copper as possible.
 +  * Scour around your fiducials after plating. It makes a noticeable difference to the laser.
  
 **Step 3:** [[https://gtvault.sharepoint.com/:w:/s/HiveMakerspace/ERfKdS6GbVpJo6k_gJ1MgLgB3VVaU7ckSrJCkb4FGMK1IA?e=1rAYmW|Etching with the ProtoLaser]] **Step 3:** [[https://gtvault.sharepoint.com/:w:/s/HiveMakerspace/ERfKdS6GbVpJo6k_gJ1MgLgB3VVaU7ckSrJCkb4FGMK1IA?e=1rAYmW|Etching with the ProtoLaser]]
  • process_2s-plate.txt
  • Last modified: 2022/09/07 15:18
  • by benh