Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revisionNext revision | Previous revisionNext revisionBoth sides next revision | ||
pcb-help_fab [2021/01/13 22:35] – benh | pcb-help_fab [2021/01/15 12:44] – benh | ||
---|---|---|---|
Line 1: | Line 1: | ||
- | I’m ready to have my board professional fabricated. | + | === Table of Contents === |
- | We don’t officially recommend any of the following fabrication houses. All of them have positives | + | - Is there a recommended DRC/CAM file I can use? |
+ | - Do I have to be with my board during the entire fabrication process? | ||
+ | - How long does it take to make a board? | ||
+ | - How long does electroplating take? | ||
+ | - Can I somehow reserve time on the equipment? | ||
+ | - Can I add soldermask or silkscreen? | ||
+ | - Do the tools have additional capabilities? | ||
+ | - Do the tools have additional capabilities? | ||
+ | - Process capabilities | ||
- | ===Fabrication=== | + | ---- |
- | + | ||
- | ** Process specifications **\\ | + | |
- | The Hive's PCB fabrication tool suite has the following capabilites: | + | |
- | * // | + | |
- | * //Copper thickness/ | + | |
- | * //Trace width (minimum):// | + | |
- | * //Trace pitch (minimum):// | + | |
- | * //Drill holes (minimum diameter):// | + | |
- | * //Slot:// yes, use overlapping drill hits | + | |
- | * // | + | |
- | + | ||
- | ** Can I add soldermask or silkscreen? **\\ | + | |
- | We have the capability to apply soldermask and silkscreen, though we //do not// recommend attempting this process | + | |
- | + | ||
- | For those who would like to attempt this, instructions are available on our [[pcb-mask-silkscreen-SOP| mask and silkscreen]] page, as well as in the " | + | |
**Is there a recommended DRC/CAM file I can use?**\\ | **Is there a recommended DRC/CAM file I can use?**\\ | ||
Line 34: | Line 27: | ||
**Can I somehow reserve time on the equipment? | **Can I somehow reserve time on the equipment? | ||
- | Yes! Although you are not required to, we //highly// recommend that you do as it guarantees equipment priority. You may reserve time up to 96 hours in advance though SUMS. See the SUMS Guide for more details. | + | Yes! Although you are not required to, we //highly// recommend that you do as it guarantees equipment priority. You may reserve time up to 96 hours in advance though SUMS. |
- Go to sums.gatech.edu and login (button is on the top right of the screen). | - Go to sums.gatech.edu and login (button is on the top right of the screen). | ||
- In the main toolbar on top, on the right, click "Set Active BG/ | - In the main toolbar on top, on the right, click "Set Active BG/ | ||
Line 45: | Line 38: | ||
* Non-PIs (i.e. those who are not volunteers at The Hive) may schedule a maximum of 4 hour block per tool per day during The Hive’s open hours, and up to 4 days in advance. | * Non-PIs (i.e. those who are not volunteers at The Hive) may schedule a maximum of 4 hour block per tool per day during The Hive’s open hours, and up to 4 days in advance. | ||
* PI’s may schedule up to 8 hours per tool per day, up to 7 days in advance. | * PI’s may schedule up to 8 hours per tool per day, up to 7 days in advance. | ||
+ | |||
+ | ** Can I add soldermask or silkscreen? **\\ | ||
+ | We have the capability to apply soldermask and silkscreen, though we //do not// recommend attempting this process - it's time-consuming, | ||
+ | |||
+ | For those who would like to attempt this, instructions are available on our [[pcb-mask-silkscreen-SOP| mask and silkscreen]] page, as well as in the " | ||
** Do the tools have additional capabilities? | ** Do the tools have additional capabilities? | ||
- | //NOTE: The following | + | Many! See the Knowledge Base page for these, as they' |
- | The ProtoMat has the capability to do aluminum and plastic 2-dimensional milling. The ProtoLaser can etch a very wide variety of substrates and films. The electroplater has the ability to do tin plating (though we don't carry the necessary solution by default). We also have the LPKF ProConduct system that enables manual electropating of individual vias for RF PCBs (proceed with caution here). | + | |
- | The full suit includes the following: | + | ** Process capabilities and specifications **\\ |
+ | The full suite of LPKF tools at The Hive includes the following: | ||
* LPKF ProtoMat S103 ([[https:// | * LPKF ProtoMat S103 ([[https:// | ||
* LPKF ProtoLaser U4 ([[https:// | * LPKF ProtoLaser U4 ([[https:// | ||
Line 58: | Line 56: | ||
* LPKF ProtoPrint S ([[https:// | * LPKF ProtoPrint S ([[https:// | ||
* LPKF ProtoFlow ([[https:// | * LPKF ProtoFlow ([[https:// | ||
- | * LPKF ProConduct ([[https:// | + | * LPKF ProConduct ([[https:// |
- | See our [[pcb-sops|Standard Operating Procedures]] page for further details. | + | The Hive's PCB fabrication tool suite has the following capabilites: |
+ | * // | ||
+ | * //Copper thickness/ | ||
+ | * //Trace width (minimum):// | ||
+ | * //Trace pitch (minimum):// | ||
+ | * //Drill holes (minimum diameter):// | ||
+ | * //Slot:// yes, YMMV | ||
+ | * // | ||
- | ---- | ||
- | === Process Specifications and Tolerances === | ||
If you’re board passes OshPark’s specs ([[https:// | If you’re board passes OshPark’s specs ([[https:// | ||