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==== PCB Fabrication ==== | ==== PCB Fabrication ==== | ||
+ | === Table of Contents === | ||
+ | - General processing reminders | ||
+ | - Process Guides | ||
+ | - Process Capabilites | ||
+ | - Process Specifications and Tolerances | ||
- | Overview, specs, links to other docs | + | ---- |
+ | === General Processing Reminders...=== | ||
+ | * Orient all your boards *before* creating any fiducials. | ||
+ | * 4 fiducials – always. | ||
+ | * Don't forget | ||
+ | * Make sure that the two boxes are checked before selecting a ProtoLaser template. | ||
+ | * Do not forget the chemical safety gear when electroplating. | ||
+ | * ** Get a PI to change any bits in the ProtoMat!** | ||
- | Which process are you interested in? | + | ---- |
+ | === Process Guides === | ||
- | - [[process_1S-noHoles|Single sided, no holes]] | + | - [[process_1S-noHoles|Single sided design, no holes]], regardless of plating. |
- | - [[process_1S-holes|Single sided, with holes]] | + | - [[process_1S-holes|Single sided design, with holes]], regardless of plating. |
- | - [[process_2S-noPlate|Double sided, no plating]] | + | - [[process_2S-noPlate|Double sided, no plating]], regardless of hole count. |
- | - [[process_2S-plate|Double sided, with plating]] | + | - [[process_2S-plate|Double sided, with plating]], regardless of hole count. |
+ | - [[process_stencils|Solderpaste stencils]] | ||
+ | - [[process_reflowOven|Reflow oven]] | ||
+ | - [[process_kaptonmask|Kapton tape soldermasking]] // | ||
- | **HELP!** --> | + | **HELP!** --> |
+ | \\ | ||
+ | See our [[pcb-tips|tips and tricks]] page for some advanced processing concepts (or just interesting tidbits).\\ | ||
+ | \\ | ||
+ | //The above guides | ||
---- | ---- | ||
- | These guides is targeted towards End Users and PIs (Peer Instructors) who want to know about the standard fabrication process often employed at The Hive, either before they are certified or afterwards. It is not intended to serve as a technical manual for any of these three tools or the software that controls them; for those, see the individual tool SOPs. It is also not intended to serve as a complete list of all processes that can be achieved with this tool suite. It is simply a step-by-step guide to our two most basic and standardized processes. | + | === Process |
- | ---- | + | The Hive has a suite of LPKF tools that enable students to fabricate 2-layer prototype-quality PCBs with fully-plated vias on campus. With additional setup, they can also apply soldermask and silkscreen for a production-quality finish, cut a solder paste stencil for part placement, and a reflow solder the components to the board. The tools have numerous additional capabilities beyond simple PCB fabrication, |
- | === Capabilities === | + | |
- | The Hive has a suite of LPKF tools that enable students to fabricate 2-layer prototype-quality PCBs with fully-plated vias on campus. With additional setup, they can also apply soldermask and silkscreen for a production-quality finish, cut a solder paste stencil for part placement, and a reflow solder the components to the board. The tools have numerous additional capabilities beyond simple PCB fabrication, | + | |
+ | The Hive's PCB fabrication tool suite has the following capabilities: | ||
+ | * // | ||
+ | * //Copper thickness/ | ||
+ | * //Slot:// yes, but YMMV. See our [[pcb-tips|fabs tips]] page for details. | ||
+ | * // | ||
+ | * // | ||
+ | * // | ||
+ | * // | ||
+ | * //Reflow:// we have a fully operational reflow oven, optimized for lead-free solder paste. See " | ||
+ | * Our [[pcb-help|knowledge base]] is pretty extensive as well, so check that for answers to many questions and processing help. | ||
- | Process Specifications and Tolerances | + | The full suit includes the following: |
- | If you’re board passes OshPark’s specs (OshPark | + | * LPKF ProtoMat S103 ([[https:// |
+ | * LPKF ProtoLaser U4 ([[https:// | ||
+ | * LPKF Contac S4 ([[https:// | ||
+ | * LPKF ProMask ([[https:// | ||
+ | * LPKF ProLegend ([[https:// | ||
+ | * LPKF ProtoPrint S ([[https:// | ||
+ | * LPKF ProtoFlow ([[https:// | ||
+ | * LPKF ProConduct ([[https:// | ||
- | Specification | + | ---- |
- | Minimum/ | + | === Process Specifications and Tolerances === |
- | Recommended | + | If you’re board passes OshPark’s specs ([[https://docs.oshpark.com/design-tools/ |
- | Trace width | + | |
- | 2 mils (0.05 mm) | + | |
- | 10 mils (0.25 mm) | + | |
- | Trace spacing (“pitch”) | + | |
- | 1 mils (0.025 mm) | + | |
- | 6 mils (0.15 mm) | + | |
- | Polygon isolation | + | |
- | 10 mils (0.25 mm) | + | |
- | 30 mils (0.75 mm) | + | |
- | Drill hit | + | |
- | 6 mil (0.15 mm) | + | |
- | 15 mil (0.4 mm) | + | |
- | Drill X/Y resolution | + | |
- | +/- 0.01 mil (0.25 μm) | + | |
- | + | ||
- | + | ||
- | Drill repeat accuracy | + | |
- | +/- 0.2 mil (5 μm) | + | |
- | + | ||
- | + | ||
- | Laser repeatability | + | |
- | 0.08 mils (2 μm) | + | |
- | + | ||
- | + | ||
- | Drill hit | + | |
- | 0.05 mil (1.2 μm) | + | |
+ | ^ Specification ^ Theoretical Minimum ^ Recommended Minimum ^ | ||
+ | | Trace width | 1 mils (0.05 mm) | 5 mils (0.25 mm) | | ||
+ | | Trace spacing (“pitch”) | 1 mils (0.025 mm) | 5 mils (0.15 mm) | | ||
+ | | Polygon isolation | 10 mils (0.25 mm) | 24 mils (0.75 mm) | | ||
+ | | Drill hit | 6 mil (0.15 mm) | 15 mil (0.4 mm) | | ||
+ | | Drill X/Y resolution | +/- 0.01 mil (0.25 μm) || | ||
+ | | Drill repeat accuracy | +/- 0.2 mil (5 μm) || | ||
+ | | Laser repeatability | 0.08 mils (2 μm) || | ||
+ | | Drill hit | 0.05 mil (1.2 μm) || | ||
+ | See our [[pcb-help|Knowledge Base]] and [[pcb-tips|Tips and Tricks]] pages for additional information. | ||
- | Some additional notes on board design | + | **Note:** If you're considering a design |
- | Slots are hard in this process. Please | + | |
- | Plating is typically avoidable by making vias with a diameter of 40 mil (1 mm). A standard 0.1” header pin can then be pushed through | + | |
- | Higher polygon isolation will reduce the chance of bridging to a plane during assembly (since we don’t really offer soldermask). However, it will also increase etch time. | + | |