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how-to-pcb [2020/03/12 16:59] – 143.215.93.31 | how-to-pcb [2020/03/13 11:03] – 143.215.93.31 | ||
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=== Table of Contents === | === Table of Contents === | ||
- | - Basics | + | - Introduction |
- Training Sessions | - Training Sessions | ||
- Quiz and Checkoffs | - Quiz and Checkoffs | ||
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----- | ----- | ||
- | === Basics | + | === Introduction |
**Will the PIs at the Hive make a board for me?**\\ | **Will the PIs at the Hive make a board for me?**\\ | ||
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---- | ---- | ||
===Fabrication=== | ===Fabrication=== | ||
+ | |||
+ | ** Process specifications **\\ | ||
+ | The Hive's PCB fabrication tool suite has the following capabilites: | ||
+ | * // | ||
+ | * //Copper thickness/ | ||
+ | * //Trace width (minimum):// | ||
+ | * //Trace pitch (minimum):// | ||
+ | * //Drill holes (minimum diameter):// | ||
+ | * //Slot:// yes, use overlapping drill hits | ||
+ | * // | ||
+ | |||
+ | ** Can I add soldermask or silkscreen? **\\ | ||
+ | We have the capability to apply soldermask and silkscreen, though we //do not// recommend attempting this process - it's time-consuming, | ||
+ | |||
+ | For those who would like to attempt this, instructions are available on our [[pcb-mask-silkscreen-SOP| mask and silkscreen]] page, as well as in the " | ||
**Do I have to be with my board during the entire fabrication process? | **Do I have to be with my board during the entire fabrication process? | ||
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// | // | ||
- | Non-PIs (i.e. those who are not volunteers at The Hive) may schedule a maximum of 4 hour block per tool per day during The Hive’s open hours, and up to 4 days in advance. | + | * Non-PIs (i.e. those who are not volunteers at The Hive) may schedule a maximum of 4 hour block per tool per day during The Hive’s open hours, and up to 4 days in advance. |
- | PI’s may schedule up to 8 hours per tool per day, up to 7 days in advance. | + | |
**How long does it take to make a board?**\\ | **How long does it take to make a board?**\\ | ||
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Between 2 and 3 hours, regardless of board size. This will plate between 8-15 um of copper onto your surfaces. Less than this processing time can cause unreliable vias with variable thickness of the plating. | Between 2 and 3 hours, regardless of board size. This will plate between 8-15 um of copper onto your surfaces. Less than this processing time can cause unreliable vias with variable thickness of the plating. | ||
+ | ** Do the tools have additional capabilities? | ||
+ | \\NOTE: The following capabilities are allowed in the spec of the tool, but we do not support these functions, meaning that our PIs and MPIs do not have experience with them, so you will be on your own if you attempt any of them!//\\ | ||
+ | The ProtoMat has the capability to do aluminum and plastic 2-dimensional milling. The ProtoLaser can etch a very wide variety of substrates and films. The electroplater has the ability to do tin plating (though we don't carry the necessary solution by default). We also have the LPKF ProConduct system that enables manual electropating of individual vias for RF PCBs (proceed with caution here). |